JPS49116594A - - Google Patents

Info

Publication number
JPS49116594A
JPS49116594A JP48030312A JP3031273A JPS49116594A JP S49116594 A JPS49116594 A JP S49116594A JP 48030312 A JP48030312 A JP 48030312A JP 3031273 A JP3031273 A JP 3031273A JP S49116594 A JPS49116594 A JP S49116594A
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP48030312A
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP48030312A priority Critical patent/JPS49116594A/ja
Publication of JPS49116594A publication Critical patent/JPS49116594A/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L24/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
    • H01L24/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H01L2224/321—Disposition
    • H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/32225—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Conductive Materials (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Non-Adjustable Resistors (AREA)
  • Die Bonding (AREA)
JP48030312A 1973-03-14 1973-03-14 Pending JPS49116594A (en])

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP48030312A JPS49116594A (en]) 1973-03-14 1973-03-14

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP48030312A JPS49116594A (en]) 1973-03-14 1973-03-14

Publications (1)

Publication Number Publication Date
JPS49116594A true JPS49116594A (en]) 1974-11-07

Family

ID=12300253

Family Applications (1)

Application Number Title Priority Date Filing Date
JP48030312A Pending JPS49116594A (en]) 1973-03-14 1973-03-14

Country Status (1)

Country Link
JP (1) JPS49116594A (en])

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS51146538A (en) * 1975-06-11 1976-12-16 Hitachi Ltd An electroconductive adhesive material
JPS5868803A (ja) * 1981-10-21 1983-04-23 ティーディーケイ株式会社 導電性ペ−スト組成物
JPS5873904A (ja) * 1981-08-03 1983-05-04 ジヨンソン・マシ−・インコ−ポレ−テツド 銀充填ガラス
JPS5879837A (ja) * 1981-10-31 1983-05-13 Tdk Corp 磁器コンデンサ
JPS5967241A (ja) * 1982-10-08 1984-04-16 Kureha Chem Ind Co Ltd 魚油中のエイコサペンタエン酸の濃縮方法
JPH02106954A (ja) * 1988-10-17 1990-04-19 Semiconductor Energy Lab Co Ltd 電子装置
WO2006062208A1 (ja) * 2004-12-09 2006-06-15 Asahi Co., Ltd 成型金型の補修方法、耐熱性無機接着剤、成型金型及び成型製品
JP4726803B2 (ja) * 2004-12-09 2011-07-20 株式会社 旭 成型金型の補修方法、成型金型及び成型製品
JP2014012840A (ja) * 2013-07-16 2014-01-23 Univ Of Tokyo 接着材組成物

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS51146538A (en) * 1975-06-11 1976-12-16 Hitachi Ltd An electroconductive adhesive material
JPS5873904A (ja) * 1981-08-03 1983-05-04 ジヨンソン・マシ−・インコ−ポレ−テツド 銀充填ガラス
JPS5868803A (ja) * 1981-10-21 1983-04-23 ティーディーケイ株式会社 導電性ペ−スト組成物
JPS5879837A (ja) * 1981-10-31 1983-05-13 Tdk Corp 磁器コンデンサ
JPS5967241A (ja) * 1982-10-08 1984-04-16 Kureha Chem Ind Co Ltd 魚油中のエイコサペンタエン酸の濃縮方法
JPH02106954A (ja) * 1988-10-17 1990-04-19 Semiconductor Energy Lab Co Ltd 電子装置
WO2006062208A1 (ja) * 2004-12-09 2006-06-15 Asahi Co., Ltd 成型金型の補修方法、耐熱性無機接着剤、成型金型及び成型製品
JP4726803B2 (ja) * 2004-12-09 2011-07-20 株式会社 旭 成型金型の補修方法、成型金型及び成型製品
JP2014012840A (ja) * 2013-07-16 2014-01-23 Univ Of Tokyo 接着材組成物

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